DocumentCode
2761780
Title
Novel miniaturized packaging for implantable electronic devices
Author
Qian, Karen ; De Beeck, Maaike Op ; Bryce, George ; Malachowski, Karl ; Van Hoof, Chris
Author_Institution
Imec, Leuven, Belgium
fYear
2012
fDate
4-6 June 2012
Firstpage
1
Lastpage
3
Abstract
A novel biocompatible packaging process for implantable electronic systems is described, combining excellent biocompatibility and hermeticity with extreme miniaturization. Biocompatible and clean room compatible materials and integration processes are evaluated and selected for die encapsulation and interconnection. Cytotoxicity, diffusion tests and corrosion tests using DI water and more aggressive bio-fluids demonstrated promising performance of the packaging.
Keywords
corrosion; electronics packaging; encapsulation; DI water; biocompatible packaging process; biofluids; corrosion tests; cytotoxicity; die encapsulation; diffusion tests; implantable electronic devices; integration processes; miniaturized packaging; Corrosion; Electrodes; Encapsulation; Implants; Materials; Standards;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference (IITC), 2012 IEEE International
Conference_Location
San Jose, CA
ISSN
pending
Print_ISBN
978-1-4673-1138-0
Electronic_ISBN
pending
Type
conf
DOI
10.1109/IITC.2012.6251669
Filename
6251669
Link To Document