Evaluation of loss and APHC of DC-biased low K transmission line in MMICs technologies

Author

Wu, Hung-Wei ; Weng, Min-Hang ; Su, Yan-Kuin ; Hung, Cheng-Yuan ; Yang, Ru-Yuan

Author_Institution

Nat. Cheng Kung Univ., Tainan

fYear

2006

fDate

12-15 Dec. 2006

Firstpage

1288

Lastpage

1291

Abstract

In this paper, effective dielectric constant, line attenuation and characteristic impedance, average power handling capability (APHC) of DC-biased thin film microstrip line (TFML) as interconnection for monolithic microwave integrated circuits (MMICs) is investigated. The TFML is fabricated on standard low resistivity silicon (LRS) substrate (rho les 10 Omega-cm ) by incorporating a spin-on dielectric polyimide and sputtering of aluminum. An accurate on-wafer-procedure for extracting the microwave characteristics of TFML up to 50 GHz is described and the method is successfully applied to low-K polyimide deposited on the silicon.

Keywords

MMIC; microstrip lines; thin film circuits; APHC; DC-biased low k transmission line; DC-biased thin film microstrip line; MMIC technologies; aluminum sputtering; average power handling capability; effective dielectric constant; line attenuation; low resistivity silicon substrate; monolithic microwave integrated circuits; spin-on dielectric polyimide; Dielectric substrates; Dielectric thin films; Distributed parameter circuits; MMICs; Polyimides; Power transmission lines; Propagation losses; Silicon; Sputtering; Transmission lines; Attenuation; Average Power Handling; Capability (APHC); MMIC; low K; thin film microstrip line (TFML);

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2006. APMC 2006. Asia-Pacific

Conference_Location

Yokohama

Print_ISBN

978-4-902339-08-6

Electronic_ISBN

978-4-902339-11-6

Type

conf

DOI

10.1109/APMC.2006.4429641

Filename

4429641