DocumentCode
2762513
Title
Modeling lifetime of high power IGBTs in wind power applications - An overview
Author
Busca, Cristian
Author_Institution
Dept. of Energy Technol., Aalborg Univ., Aalborg, Denmark
fYear
2011
fDate
27-30 June 2011
Firstpage
1408
Lastpage
1413
Abstract
The wind power industry is continuously developing bringing to the market larger and larger wind turbines. Nowadays reliability is more of a concern than in the past especially for the offshore wind turbines since the access to offshore wind turbines in case of failures is both costly and difficult. Lifetime modeling of future large wind turbines is needed in order to make reliability predictions about these new wind turbines early in the design phase. By doing reliability prediction in the design phase the manufacturer can ensure that the new wind turbines will live long enough. This paper represents an overview of the different aspects of lifetime modeling of high power IGBTs in wind power applications. In the beginning, wind turbine reliability survey results are briefly reviewed in order to gain an insight into wind turbine subassembly failure rates and associated downtimes. After that the most common high power IGBT failure mechanisms and lifetime prediction models are reviewed in more detail.
Keywords
insulated gate bipolar transistors; offshore installations; power bipolar transistors; power generation reliability; wind turbines; high power IGBT; lifetime modeling; offshore wind turbine reliability; wind power applications; wind power industry; wind turbine subassembly failure rates; Failure analysis; Insulated gate bipolar transistors; Reliability; Soldering; Wind power generation; Wind turbines; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics (ISIE), 2011 IEEE International Symposium on
Conference_Location
Gdansk
ISSN
Pending
Print_ISBN
978-1-4244-9310-4
Electronic_ISBN
Pending
Type
conf
DOI
10.1109/ISIE.2011.5984366
Filename
5984366
Link To Document