DocumentCode :
2762642
Title :
Package Deformation And Cracking Mechanism Due To Reflow Soldering
Author :
Sawada, Kazuaki
fYear :
1993
fDate :
9-11 Jun 1993
Firstpage :
295
Lastpage :
298
Keywords :
Absorption; Equations; Humidity; Material storage; Moisture measurement; Reflow soldering; Resins; Semiconductor device packaging; Semiconductor devices; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
Type :
conf
DOI :
10.1109/IEMT.1993.639774
Filename :
639774
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2762642
