• DocumentCode
    2762923
  • Title

    Influence Of Newly Molding Compound Properties On Package Failure During Reflow Soldering Process

  • Author

    Murayama, Masakazu ; Ito, Hiromi ; Tada, Kazuhiro ; Fujioka, Hirofumi ; Kanegae, Hirozoh

  • fYear
    1993
  • fDate
    9-11 Jun 1993
  • Firstpage
    308
  • Lastpage
    311
  • Keywords
    Absorption; Glass; Mechanical factors; Moisture; Plastic packaging; Reflow soldering; Resins; Surface cracks; Temperature; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
  • Print_ISBN
    0-7803-1432-8
  • Type

    conf

  • DOI
    10.1109/IEMT.1993.639785
  • Filename
    639785
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2762923