Title :
Design Abstract For Manufacturing Of High Density Wire Bonded VLSI Packages
Author :
Guernalec, Jean-yves ; Joly, Jean ; Saint-martin, Xavier
Keywords :
Assembly; Bonding; Ceramics; Costs; Manufacturing; Packaging machines; Roentgenium; Silicon; Very large scale integration; Wire;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
DOI :
10.1109/IEMT.1993.639805
