The factors influencing environmental reliability of chip-on glass technology

To examine the practicality of applying the chip-on-glass packaging technique to liquid-crystal-display (LCD) panels, the authors investigate how reliability is affected by different types of glass substrates and sealing resins, using 63% Sn-Pb solder for the bump contacts of a flip-chip. The results suggest that packaging failure can be reduced even when 63% Sn-Pb solder bump contacts are used as long as the glass substrate is properly selected. It is also confirmed that service life can be prolonged beyond that of a bare chip by proper materials selection and that expansion coefficient and longitudinal elastic constant are the most important factors in selecting the resin material