مرکز منطقه ای اطلاع رساني علوم و فناوري - A Stud-bump-bonding Technique For High Density Multi-chip-module

DocumentCode :

2765104

Title :

A Stud-bump-bonding Technique For High Density Multi-chip-module

Author :

Bessho, Yoshihiro ; Tomura, Yoshihiro ; Hakotani, Yasuhiko ; Tsukamoto, Masahide ; Ishlda, T. ; Omoya, Kazunori

fYear :

1993

fDate :

9-11 Jun 1993

Firstpage :

362

Lastpage :

365

Keywords :

Artificial intelligence; Bonding; Ceramics; Conductive adhesives; Electrodes; Gold; Large scale integration; Packaging; Stress; Wire;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International

Print_ISBN :

0-7803-1432-8

Type :

conf

DOI :

10.1109/IEMT.1993.639807

Filename :

639807

Link To Document :