Title :
Fine Pitch Tab-lsi Interconnection Technology In MCM
Author :
Mori, Fumio ; Kudo, Kiyofumi ; Tsukamoto, Kenji
Keywords :
Bonding; Ceramics; Electronics packaging; Integrated circuit interconnections; Large scale integration; Logic; Pins; Polyimides; Space technology; Supercomputers;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
DOI :
10.1109/IEMT.1993.639808
