Low temperature conformal silicon dioxide deposition using supercritical fluid for polymer-based MEMS

Author

Yamada, H. ; Momose, T. ; Kitamura, Y. ; Hattori, Y. ; Shimogaki, Y. ; Sugiyama, M.

Author_Institution

3D BEANS Center, BEANS Project, Tokyo, Japan

fYear

2011

fDate

23-27 Jan. 2011

Firstpage

49

Lastpage

52

Abstract

A novel supercritical fluid deposition method (SCFD) of SiO₂ has been developed for polymer-based MEMS. In order to reduce deposition temperature for the application to polymer-based MEMS process, we selected O₃ as an oxidant in SiO₂-SCFD. Conformal SiO₂ deposition on Si trenches (aspect ratio 24) at low temperatures (below 200°C) was achieved, which were acceptable for deposition on polymers. In addition, SiO₂ coating on inner wall surface of microchannels, which was made of polydimethylsiloxane (PDMS), was demonstrated.

Keywords

micromechanical devices; polymers; silicon compounds; PDMS; SCFD; SiO₂; deposition temperature reduction; low temperature conformal silicon dioxide deposition; microchannels; polydimethylsiloxane; polymer-based MEMS process; supercritical fluid deposition method; Coatings; Films; Inductors; Microchannel; Silicon; Substrates; Surface treatment;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on

Conference_Location

Cancun

ISSN

1084-6999

Print_ISBN

978-1-4244-9632-7

Type

conf

DOI

10.1109/MEMSYS.2011.5734359

Filename

5734359