Antenna in HSBGA package for 2.4 GHz WLAN application

A novel AiP(antenna in package) technology has been proposed. The antenna apparatus, which has a heat dissipation function and characteristic of radiation at the same time, can be realized by simply cutting and bending a metal plate and implemented it with standard package process that is very useful for mass production. As the demands of the integration increase, it is inevitable to integrate the antenna into the same RF FEM (front end module) package to achieve total RF system in single package.