DocumentCode :
2765599
Title :
Monolithically integrated junction FETS and NEMS
Author :
Amponsah, Kwame ; Lal, Amit
Author_Institution :
SonicMEMS Lab., Cornell Univ., Ithaca, NY, USA
fYear :
2011
fDate :
23-27 Jan. 2011
Firstpage :
91
Lastpage :
94
Abstract :
We present the monolithic integration of junction FETS and NEMS for enhanced signal transduction and signal processing. Monolithic integration is preferred to hybrid integration due to reduce parasitics and mismatches. In this paper, the JFET is integrated directly into SOI MEMS cantilever to form an extra-tight integration between sensing and electronic integration. When a cantilever connected to the JFET is electrostatically actuated; its motion directly affects the current in the JFET. The devices were realized in 2um thick SOI cross-wire beams, with a novel MoSi2 contact metallization for stress minimization and ohmic contact. The pull-in voltage for the NEMS cantilever was 21V and the pinch-off voltage of the JFET was -19V.
Keywords :
cantilevers; integrated circuit metallisation; junction gate field effect transistors; monolithic integrated circuits; nanoelectromechanical devices; ohmic contacts; signal processing; silicon-on-insulator; JFET; NEMS cantilever; SOI MEMS cantilever; SOI cross-wire beam; contact metallization; enhanced signal transduction; extra-tight integration; hybrid integration; monolithically integrated junction FET; ohmic contact; pull-in voltage; signal processing; size 2 mum; stress minimization; voltage -19 V; voltage 21 V; Capacitance; JFETs; Junctions; Logic gates; Micromechanical devices; Monolithic integrated circuits; Nanoelectromechanical systems;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on
Conference_Location :
Cancun
ISSN :
1084-6999
Print_ISBN :
978-1-4244-9632-7
Type :
conf
DOI :
10.1109/MEMSYS.2011.5734369
Filename :
5734369
Link To Document :
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