Title :
A Low Cost Multi-chip Module Using Fine Line Thick Film And Solder Ball Bump Interconnection Methods
Author :
Segawa, Masao ; Saito, Yasuhito ; Ogashiwa, Toshinori ; Akimoto, Hideyuki
Keywords :
Aluminum; Bonding forces; Bonding processes; Costs; Electrodes; Integrated circuit interconnections; Production; Thick films; Tin; Wire;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
DOI :
10.1109/IEMT.1993.639810
