DocumentCode
2765986
Title
Multilayer composite for below ground embedded sensor networking
Author
Jeong, Seongheon ; Yang, Chin-Lung ; Courter, John R. ; Kim, Seung-il ; Pipes, R. Byron ; Chappell, William J.
Author_Institution
Dept. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN
fYear
2008
fDate
5-11 July 2008
Firstpage
1
Lastpage
4
Abstract
Sewage systems are being retrofit with sensor networks to reduce their deleterious effects on human health and the environment. To implement the sensor networks a conventional cast-iron manhole cover is replaced with a robust composite manhole cover antenna. The difficulties in designing the antenna in a manhole cover are that the antenna must radiate in a harsh environment, at ground level, and maintain low-profile. The cover must maintain structural loads as large as 2,000 pounds, due to the presence of traffic, while simultaneously being relatively dasiatransparentpsila for RF radiation from below ground sensors. To verify a prototype, a simple composite sandwich structure is designed, fabricated, and integrated with an aluminum slot antenna. This composite manhole cover antenna is analyzed with full-wave simulations and measured in an anechoic chamber. The simulated results show a good agreement with measured results. The magnetically center-fed slot antenna shows 2.13 dB of measured gain within the fiberglass sandwich structure.
Keywords
condition monitoring; intelligent sensors; sandwich structures; sewage treatment; slot antennas; wireless sensor networks; RF radiation; aluminum slot antenna; anechoic chamber; below ground embedded sensor networking; fiberglass sandwich structure; full-wave simulation; human health; magnetic center-fed slot antenna; multilayer composite manhole cover antenna; sewage system; Antenna measurements; Humans; Magnetic sensors; Nonhomogeneous media; Radio frequency; Robustness; Sandwich structures; Sensor systems; Slot antennas; Traffic control;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium, 2008. AP-S 2008. IEEE
Conference_Location
San Diego, CA
Print_ISBN
978-1-4244-2041-4
Electronic_ISBN
978-1-4244-2042-1
Type
conf
DOI
10.1109/APS.2008.4619245
Filename
4619245
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