Heterogeneous integration technology for combination of different wafer sizes using an expandable handle substrate

This paper reports on the realization of a novel method for batch transfer of multiple separate dies from a smaller substrate onto a larger wafer substrate by using a standard matrix expander in combination with adhesive wafer bonding and an elastic dice tape. We demonstrate the expansion and transfer of about 30000 chips from a 100 mm wafer to a 200 mm wafer with a 22 μm standard deviation of positioning accuracy. Fabrication, evaluation method and results are presented.