Title :
Wafer-level chip scale flexible wireless microsystem fabrication
Author :
Chao, Tzu-Yuan ; Cheng, Y.T.
Author_Institution :
Dept. of Electron. Eng. & Inst. of Electron., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Abstract :
The paper demonstrates a low-cost flexible wireless microsystem fabrication technology combining the previously developed bumpless RFSOP scheme with a special surface cleaning process to assemble a CMOS chip with an organic substrate (SU-8/PDMS) by Au-Au thermocompressive bonds (<;200°C). About -15dB return loss and -0.8dB insertion loss @ 40GHz interconnecting structure and above 6MPa bonding strength make the technology practical for flexible wireless microsystem integration. Besides, taking advantage of chemical inertia of Au, a wafer-level sacrificial release process is performed for the low-cost fabrication.
Keywords :
CMOS integrated circuits; body sensor networks; chip scale packaging; microfabrication; micromechanical devices; surface cleaning; tape automated bonding; wafer level packaging; CMOS chip; SU-8-PDMS; bonding strength; bumpless RFSOP scheme; chemical inertia; flexible wireless microsystem fabrication; frequency 40 GHz; loss -0.8 dB; loss -15 dB; organic substrate; surface cleaning process; thermocompressive bonds; wafer-level chip scale; wafer-level sacrificial release process; wireless body sensor networks; Bonding; CMOS integrated circuits; Copper; Silicon; Substrates; Wireless communication;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on
Conference_Location :
Cancun
Print_ISBN :
978-1-4244-9632-7
DOI :
10.1109/MEMSYS.2011.5734432
