Author :
Guo, B. ; Wen, L. ; Helin, P. ; Claes, G. ; Verbist, A. ; Van Hoof, R. ; Du Bois, B. ; De Coster, J. ; De Wolf, I. ; Shahar, A. Hadi ; Li, Y. ; Cui, H. ; Lux, M. ; Vereecke, G. ; Tilmans, H.A.C. ; Haspeslagh, L. ; Decoutere, S. ; Osman, H. ; Puers, R. ; S
Abstract :
We present an attractive poly-SiGe thin film packaging and MEM (Micro Electro-Mechanical) platform technology for integrating various packaged MEM devices above standard CMOS. The packages, having cavities as large as 1 mm2, make use of pillars designed to withstand subsequent molding during 1st level packaging. Covers on top of the release holes avoid deposition inside the cavity during sealing. Hermeticity is proven in vacuum, air and N2 atmosphere and at different temperatures. Packaged functional accelerometers sealed at a pressure around 1 bar, have an equivalent performance in measuring accelerations of about 1 g compared to a piezoelectric commercial reference device.
Keywords :
CMOS integrated circuits; Ge-Si alloys; accelerometers; micromechanical devices; piezoelectric devices; wafer level packaging; CMOS technology; MEM device platform technology; SiGe; accelerometer; hermeticity; piezoelectric device; pressure 1 bar; sealing; thin film packaging; Accelerometers; CMOS integrated circuits; Cavity resonators; Micromechanical devices; Packaging; Silicon germanium; Temperature measurement;
