• DocumentCode
    2767464
  • Title

    Simultaneous dual-mode excitation of piezo-on-silicon micromechanical oscillator for self-temperature sensing

  • Author

    Dalal, M.J. ; Fu, J.L. ; Ayazi, F.

  • Author_Institution
    Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2011
  • fDate
    23-27 Jan. 2011
  • Firstpage
    489
  • Lastpage
    492
  • Abstract
    This paper demonstrates a dual-mode (DM) oscillator which simultaneously excites the fundamental and third-order modes of a micromachined, piezo-on-silicon bulk acoustic wave (BAW) resonator for real-time self-temperature measurement. By concurrently measuring the temperature coefficient of frequency (TCF) at 30 MHz (f1) and 87 MHz (f3), a beat frequency (fb) with TCF of 162 ppm/°C is extracted. Phase measurements of the third-order harmonic before and after DM excitation show signal degradation close to carrier and improvement far from carrier. This is attributed to the loaded Q of both modes and the introduction of spurious modes near resonance. In addition, the beat frequency linearity is compared over several devices with varying Q, confirming that Q of each individual mode directly affects the oscillator stability and ultimately temperature measurement accuracy.
  • Keywords
    acoustic resonators; bulk acoustic wave devices; elemental semiconductors; micromechanical devices; oscillators; silicon; temperature sensors; 3*U-U; beat frequency linearity; frequency 30 MHz to 87 MHz; micromachined bulk acoustic wave resonator; oscillator stability; piezo-on-silicon bulk acoustic wave resonator; piezo-on-silicon micromechanical oscillator dual-mode excitation; real-time self-temperature measurement; third-order harmonic; third-order modes; Delta modulation; Frequency measurement; Phase noise; Resonant frequency; Temperature measurement; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on
  • Conference_Location
    Cancun
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-9632-7
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2011.5734468
  • Filename
    5734468