• DocumentCode
    2767669
  • Title

    Performance Evaluation of Probe-Send Fault-tolerant Network-on-chip Router

  • Author

    Mediratta, Sumit Dharampal ; Draper, Jeffrey

  • Author_Institution
    NVIDIA Graphics Pvt Ltd, Bangalore
  • fYear
    2007
  • fDate
    9-11 July 2007
  • Firstpage
    69
  • Lastpage
    75
  • Abstract
    With increasing reliability concerns for current and next generation VLSI technologies, fault-tolerance is fast becoming an integral part of system-on-chip and multi-core architectures. Another trend for such architectures is network-on-chip (NoC) becoming a standard for on-chip global communication. In an earlier work, a generic fault-tolerant routing algorithm in the context of NoCs has been presented. The proposed routing algorithm works in two phases, namely path exploration (PE) and normal communication. This paper presents fundamental insights into various novel PE approaches, their feasibility and performance trade-offs for k-ary 2-cube NoCs. The dependence of the normal communication phase on the probability of finding paths and their quality in the first phase emphasizes the PE´s significance. One major contribution of this work is the investigation of application of constrained randomness to PE for optimizing the quality of paths. Another contribution is the proposed use of merging of traffic to reduce the reconfiguration time by a large amount (73.8% on an average).
  • Keywords
    VLSI; fault tolerance; network-on-chip; reliability; fault-tolerance; generic fault-tolerant routing algorithm; multi-core architectures; next generation VLSI; path exploration; probe-send fault-tolerant network-on-chip router; system-on-chip; Communication standards; Context; Fault tolerance; Fault tolerant systems; Global communication; Network-on-a-chip; Routing; System-on-a-chip; Telecommunication network reliability; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Application-specific Systems, Architectures and Processors, 2007. ASAP. IEEE International Conf. on
  • Conference_Location
    Montreal, Que.
  • ISSN
    2160-0511
  • Print_ISBN
    978-1-4244-1026-2
  • Electronic_ISBN
    2160-0511
  • Type

    conf

  • DOI
    10.1109/ASAP.2007.4429960
  • Filename
    4429960