Title :
Hewlett packard´s seismic grade MEMS accelerometer
Author :
Homeijer, B. ; Lazaroff, D. ; Milligan, D. ; Alley, R. ; Wu, J. ; Szepesi, M. ; Bicknell, B. ; Zhang, Z. ; Walmsley, R.G. ; Hartwell, P.G.
Author_Institution :
Technol. Dev. Organ., Hewlett Packard Co., Corvallis, OR, USA
Abstract :
HP has recently made its plans to develop an ultrahigh-resolution seismic sensing solution public. This solution is being developed with Royal Dutch Shell Corporation for oil and gas exploration. Central to delivering this system is HP´s new single axis seismic grade MEMS accelerometer. The HP device uses both bulk micromachining methods and standard thin film technologies as well as HP´s new three phase sensing technology. This sensor detects motion when an array of electrodes located on the proof mass moves relative to a stationary array of electrodes across a fixed gap. Initial characterization shows a flat noise power spectral density of <; 100 nG/vHz over a bandwidth of DC-200 Hz. The device exhibits a linear response to +/- 150mG with a sensitivity of over 25 V/g within the specified bandwidth.
Keywords :
accelerometers; electrodes; microsensors; Hewlett Packard seismic grade MEMS accelerometer; electrode stationary array; flat noise power spectral density; frequency 200 Hz; Accelerometers; Electrodes; Micromechanical devices; Noise; Sensitivity; Sensors; Suspensions;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on
Conference_Location :
Cancun
Print_ISBN :
978-1-4244-9632-7
Electronic_ISBN :
1084-6999
DOI :
10.1109/MEMSYS.2011.5734492
