• DocumentCode
    2768073
  • Title

    Temperature-Aware Submesh Allocation Scheme for Heat Balancing on Chip-Multiprocessors

  • Author

    Liao, Xiongfei ; Jigang, Wu ; Srikanthan, Thambipillai

  • Author_Institution
    Nanyang Technol. Univ., Singapore
  • fYear
    2007
  • fDate
    9-11 July 2007
  • Firstpage
    228
  • Lastpage
    233
  • Abstract
    This paper explores the thermal problems in future CMPs in multiprogrammed environment for heat balancing. We first give the observation of the temperature variation of cores in this scenario. Then we propose a temperature-aware submesh allocation scheme to manage cores with submeshes and allocate submeshes of cores to jobs under temperature-aware policies to balance heat chip-wide. Several scheduling policies are suggested and a HotSpot-based thermal simulator is used to evaluate the scheme and its policies under the workloads of benchmark programs. Simulation results show that our proposed scheme with global coolest policy and global neighbor-aware policy can lead to lower peak temperatures and effectively reduce the temporal variance and spatial variance of temperatures of cores to achieve better heat balance.
  • Keywords
    microprocessor chips; HotSpot-based thermal simulator; chip-multiprocessors; heat balancing; temperature-aware submesh allocation scheme; Job shop scheduling; Multicore processing; Network servers; Network-on-a-chip; Program processors; Runtime; Sun; Temperature; Thermal management; Yarn;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Application-specific Systems, Architectures and Processors, 2007. ASAP. IEEE International Conf. on
  • Conference_Location
    Montreal, Que.
  • ISSN
    2160-0511
  • Print_ISBN
    978-1-4244-1026-2
  • Electronic_ISBN
    2160-0511
  • Type

    conf

  • DOI
    10.1109/ASAP.2007.4429985
  • Filename
    4429985