DocumentCode
2768073
Title
Temperature-Aware Submesh Allocation Scheme for Heat Balancing on Chip-Multiprocessors
Author
Liao, Xiongfei ; Jigang, Wu ; Srikanthan, Thambipillai
Author_Institution
Nanyang Technol. Univ., Singapore
fYear
2007
fDate
9-11 July 2007
Firstpage
228
Lastpage
233
Abstract
This paper explores the thermal problems in future CMPs in multiprogrammed environment for heat balancing. We first give the observation of the temperature variation of cores in this scenario. Then we propose a temperature-aware submesh allocation scheme to manage cores with submeshes and allocate submeshes of cores to jobs under temperature-aware policies to balance heat chip-wide. Several scheduling policies are suggested and a HotSpot-based thermal simulator is used to evaluate the scheme and its policies under the workloads of benchmark programs. Simulation results show that our proposed scheme with global coolest policy and global neighbor-aware policy can lead to lower peak temperatures and effectively reduce the temporal variance and spatial variance of temperatures of cores to achieve better heat balance.
Keywords
microprocessor chips; HotSpot-based thermal simulator; chip-multiprocessors; heat balancing; temperature-aware submesh allocation scheme; Job shop scheduling; Multicore processing; Network servers; Network-on-a-chip; Program processors; Runtime; Sun; Temperature; Thermal management; Yarn;
fLanguage
English
Publisher
ieee
Conference_Titel
Application-specific Systems, Architectures and Processors, 2007. ASAP. IEEE International Conf. on
Conference_Location
Montreal, Que.
ISSN
2160-0511
Print_ISBN
978-1-4244-1026-2
Electronic_ISBN
2160-0511
Type
conf
DOI
10.1109/ASAP.2007.4429985
Filename
4429985
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