Title :
Technology transfer: a three-prong approach
Author :
Brown, K.H. ; Grose, D.A.
Author_Institution :
IBM, Hopewell Junction, NY, USA
Abstract :
Defines a three-prong approach to address the fundamental problems traditionally encountered in semiconductor technology transfer. The three `prongs´ are manufacturability built-in; careful evaluation and specification of new tools and processes; and integrated manufacturing and engineering teams for technology development and ownership
Keywords :
semiconductor device manufacture; semiconductor technology; integrated engineering; integrated manufacturing; manufacturability built-in; semiconductor technology transfer; technology development; Design engineering; Manufacturing processes; Optical control; Optical design; Optical sensors; Process control; Process design; Semiconductor device manufacture; Stimulated emission; Technology transfer;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1991. ASMC 91 Proceedings. IEEE/SEMI 1991
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-0152-8
DOI :
10.1109/ASMC.1991.167384
