DocumentCode
276816
Title
Structural analysis of packaged VLSI devices using scanning acoustic microscopy
Author
Howard, A.M.
Author_Institution
Towcester Tech. Services, UK
fYear
1992
fDate
33611
Firstpage
42491
Lastpage
42493
Abstract
The author describes the use of scanning acoustic microscopy (SAM) for the inspection of interfaces within the structure of an assembled VLSI component. The advantages of using SAM (non-destructive test) instead of the traditional mechanical shear testing (destructive) or X-ray analysis are discussed also
Keywords
VLSI; acoustic microscopy; inspection; integrated circuit testing; packaging; inspection; interfaces; non-destructive test; packaged VLSI devices; plastic packages; scanning acoustic microscopy;
fLanguage
English
Publisher
iet
Conference_Titel
Sub-Micron VLSI Reliability, IEE Colloquium on
Conference_Location
London
Type
conf
Filename
167547
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