DocumentCode :
2768252
Title :
Performance reliability trade-offs on high speed Si-Ge BiCMOS
Author :
O´Connel, B. ; Chaparala, Prasad ; Mehrota, B.
Author_Institution :
Nat. Semicond., Santa Clara, CA, USA
fYear :
2003
fDate :
20-23 Oct. 2003
Firstpage :
52
Lastpage :
55
Abstract :
This work investigates several gate oxides reliability-performance tradeoffs in the architecture design of a high speed BiCMOS process. Reliability concerns arise due to often conflicting requirements of MOS and bipolar devices. The many extra bipolar process steps that are added in order to realize both MOS and bipolar device types, thermal constraints, as well as many extra plasma process steps impact gate-oxide integrity (GOI).
Keywords :
BiCMOS integrated circuits; Ge-Si alloys; high-speed integrated circuits; integrated circuit design; performance evaluation; semiconductor device reliability; MOS device; bipolar device; gate oxides; high speed BiCMOS; impact gate-oxide integrity; plasma process; reliability-performance tradeoffs; thermal constraints; Annealing; BiCMOS integrated circuits; Boron; MOS capacitors; MOS devices; Plasma applications; Plasma devices; Plasma temperature; Semiconductor device reliability; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 2003 IEEE International
Print_ISBN :
0-7803-8157-2
Type :
conf
DOI :
10.1109/IRWS.2003.1283300
Filename :
1283300
Link To Document :
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