DocumentCode :
2768317
Title :
A thin-film piezoelectric PVDF-TrFE based implantable pressure sensor using lithographic patterning
Author :
Je, Sang-Soo ; Sharma, Tushar ; Lee, Youngku ; Gill, Briesh ; Zhang, John Xiaojing
Author_Institution :
Biomed. Eng., Univ. of Texas, Austin, TX, USA
fYear :
2011
fDate :
23-27 Jan. 2011
Firstpage :
644
Lastpage :
647
Abstract :
We report a thin PVDF-TrFE (polyvinyledenedifluoride-tetrafluoroethylene) copolymer film pressure sensor, fabricated using the standard lithography process for cost-effective batch process, film uniformity, and high resolution of polymer patterning. PVDF-TrFE copolymer, a semi-crystalline material, was spin-coated into thin films (1 μm thick or less) to tap the near β-phase formation. Such thin films, curing in the vacuum oven, offer significant piezoelectricity owing to the residual stress between the thin film and the substrate. Pressure measurements demonstrated that the dual film can achieve 0.6 - 1 V output voltages for 0 - 5 psi pressures, as normal physiological pressure range, with fast recovery time of around 0.2 second, and 9% low output variation.
Keywords :
curing; internal stresses; lithography; piezoelectric transducers; piezoelectricity; polymer blends; polymer films; pressure measurement; pressure sensors; spin coating; substrates; thin film sensors; β-phase formation; cost-effective batch process; curing; film uniformity; lithographic patterning; lithography process; piezoelectricity; polymer patterning; polyvinyledenedifluoride-tetrafluoroethylene; pressure measurement; residual stress; semicrystalline material; spin-coating; substrate; thin PVDF-TrFE copolymer film pressure sensor; thin-film piezoelectric PVDF-TrFE based implantable pressure sensor; vacuum oven; voltage 0.6 V to 1 V; Calibration; Coatings; Copper; Films; Heating; Radio frequency; PVDF-TrFE; Piezoelectricity; lithography; microfabrication; pressure sensor; thin film;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on
Conference_Location :
Cancun
ISSN :
1084-6999
Print_ISBN :
978-1-4244-9632-7
Type :
conf
DOI :
10.1109/MEMSYS.2011.5734507
Filename :
5734507
Link To Document :
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