• DocumentCode
    2768699
  • Title

    2003 IRW High-k discussion summary

  • fYear
    2003
  • fDate
    20-23 Oct. 2003
  • Firstpage
    153
  • Lastpage
    153
  • Abstract
    Summary form only given. In our discussion there were widely divergent opinions with regard to most important issues (some consensus) Can we assess high-k reliability now? Probably too early to draw conclusions, for three reasons: 1. probably high densities of extrinsic traps 2. processing techniques still in infancy 3. standard SiOz/Si methodologies may not be valid when applied to high-k systems. Much of our discussion revolved around the interfacial layers between the high-k dielectrics and the silicon of the channel (no consensus). It??s not clear what the chemical compositions are. Are they pure SO?? Silicon-rich SiOz? Hafnium (or other) metal silicates? A phase separated mixture of Si02 and HfOz (or other metals)? Although most attendees seemed to agree that the interfacial layer is extremely important, there was little consensus with regard to interfacial chemistry and structure.
  • Keywords
    Chemicals; Crystallization; High K dielectric materials; High-K gate dielectrics; Phonons; Scattering; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2003 IEEE International
  • Conference_Location
    Lake Tahoe, CA, USA
  • Print_ISBN
    0-7803-8157-2
  • Type

    conf

  • DOI
    10.1109/IRWS.2003.1283327
  • Filename
    1283327