• DocumentCode
    2770623
  • Title

    Electrodeformation for single cell mechanical characterization

  • Author

    Chen, Jian ; Abdelgawad, Mohamed ; Yu, Liming ; Shakiba, Nika ; Chien, Wei-Yin ; Lu, Zhe ; Geddie, William B. ; Jewett, Michael A S ; Sun, Yu

  • Author_Institution
    Inst. of Biomater. & Biomed. Eng., Univ. of Toronto, Toronto, ON, Canada
  • fYear
    2011
  • fDate
    23-27 Jan. 2011
  • Firstpage
    1119
  • Lastpage
    1122
  • Abstract
    This paper presents the use of electrodeformation as a method for single cell mechanical characterization. Cells were placed between two microelectrodes with a rectangular AC electric field applied and cell deformation recorded. Numerical simulations were performed to model cell electrodeformation based on the Maxwell stress tensor formulation in which effects of cell electrical property variations on their electrodeformed behaviors were investigated. By comparing the measured morphological changes with those obtained from numerical simulations, we were able to quantify Young´s modulus of SiHa cells (601±183 Pa) and ME180 cells (1463±649 Pa), which were then verified using conventional micropipette aspiration (SiHa: 400±290 Pa and ME180: 1070±580 Pa).
  • Keywords
    Young´s modulus; bioelectric phenomena; biological effects of fields; biomechanics; biomedical electrodes; cellular biophysics; deformation; microelectrodes; ME180 cells; Maxwell stress tensor formulation; SiHa cells; Young´s modulus; cell deformation; cell electrical property variation; electrodeformation; microelectrodes; micropipette aspiration; morphological changes; numerical simulation; rectangular AC electric field; single cell mechanical characterization; Biomembranes; Conductivity; Electric fields; Electrodynamics; Force; Young´s modulus;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on
  • Conference_Location
    Cancun
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-9632-7
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2011.5734626
  • Filename
    5734626