DocumentCode
2770643
Title
Limitations of integrating field induced aggregation based fault repair automatons with integrated circuits
Author
Dutta, Aveek ; Sambandan, Sanjiv
Author_Institution
Dept. of Instrum. & Appl. Phys., Indian Inst. of Sci., Bangalore, India
fYear
2012
fDate
12-14 Sept. 2012
Firstpage
100
Lastpage
103
Abstract
We study the limitations of integrating an automatic self repair mechanism with integrated circuits to heal open faults. The repair mechanism is based on electric field induced diffusion limited aggregation of conductive nano or micro-particles dispersed in an insulating fluid medium. The limitation is posed by the electromigration limit of the particles.
Keywords
electromigration; insulating materials; integrated circuit interconnections; maintenance engineering; nanoparticles; automatic self repair mechanism; conductive microparticle dispersion; conductive nanoparticle dispersion; diffusion limited aggregation; electric field; electromigration limit; fault repair automation; field limitation integration; insulating fluid medium; integrated circuit interconnection; open fault; Bridge circuits; Circuit faults; Current density; Dispersion; Electric fields; Integrated circuit interconnections; Maintenance engineering;
fLanguage
English
Publisher
ieee
Conference_Titel
SOC Conference (SOCC), 2012 IEEE International
Conference_Location
Niagara Falls, NY
ISSN
2164-1676
Print_ISBN
978-1-4673-1294-3
Type
conf
DOI
10.1109/SOCC.2012.6398385
Filename
6398385
Link To Document