DocumentCode :
2770856
Title :
Key directions and a roadmap for electrical design for manufacturability
Author :
Kahng, Andrew B.
Author_Institution :
Univ. of California at San Diego, La Jolla
fYear :
2007
fDate :
11-13 Sept. 2007
Firstpage :
83
Lastpage :
88
Abstract :
Semiconductor product value increasingly depends on "equivalent scaling" achieved by design and design-for-manufacturability (DFM) techniques. This talk addresses trends and a roadmap for "equivalent scaling" innovation at the design-manufacturing interface. The first part will discuss precepts of electrical DFM. What are dominant aspects of manufacturing variability and design requirements? Can designs match process, or must process inevitably adapt to designs? In what sense can concepts of "virtual manufacturing" or "statistical optimization" succeed in the design flow? How should design technology balance analyses that preserve value, versus optimizations that extend value? How should we balance preventions (correct by construction), versus early interventions, versus cures (construct by correction), versus "do no harm" opportunism? Or, tools that can model and predict well, versus tools that can make upstream assumptions come true? The second part will give a roadmap for electrical DFM technologies, motivated by emerging challenges (stress/strain engineering, mask errors, double-patterning lithography, etc.) and highlighting needs for les 45 nm nodes.
Keywords :
design for manufacture; innovation management; integrated circuit design; integrated circuit manufacture; optimisation; semiconductor device manufacture; statistical analysis; virtual manufacturing; design for manufacturability; electrical design; equivalent scaling innovation; semiconductor product value; statistical optimization; virtual manufacturing; Capacitive sensors; Design for manufacture; Design optimization; Lithography; Predictive models; Process design; Semiconductor device manufacture; Stress; Technological innovation; Virtual manufacturing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Circuits Conference, 2007. ESSCIRC 2007. 33rd European
Conference_Location :
Munich
ISSN :
1930-8833
Print_ISBN :
978-1-4244-1125-2
Type :
conf
DOI :
10.1109/ESSCIRC.2007.4430252
Filename :
4430252
Link To Document :
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