• DocumentCode
    2770948
  • Title

    Significant boiling enhancement with surfaces combining superhydrophilic and superhydrophobic patterns

  • Author

    Betz, Amy Rachel ; Jenkins, James R. ; Kim, Chang-Jin C J ; Attinger, Daniel

  • Author_Institution
    Columbia Univ., New York, NY, USA
  • fYear
    2011
  • fDate
    23-27 Jan. 2011
  • Firstpage
    1193
  • Lastpage
    1196
  • Abstract
    In this work we describe the manufacturing and characterization of patterned surfaces with large spatial contrast in wettability. We find drastic enhancement of pool boiling performance in water. In comparison to a hydrophilic SiO2 surface with a wetting angle of 7°, surfaces combining superhydrophilic and superhydrophobic patterns can quadruple the heat transfer coefficient (HTC). Superhydrophilic surface with hydrophobic islands can increase the critical heat flux (CHF) by 80%. This performance enhancement is important for applications such as electronics cooling, because the increased HTC allows a greater amount of heat to be removed at a lower wall superheat.
  • Keywords
    boiling; contact angle; heat transfer; hydrophilicity; hydrophobicity; microfabrication; micromechanical devices; nanoelectromechanical devices; nanofabrication; silicon compounds; wetting; SiO2; critical heat flux; electronics cooling; heat transfer coefficient; hydrophilic surface; hydrophobic islands; patterned surfaces; pool boiling; spatial contrast; superhydrophilic patterns; superhydrophobic patterns; water; wettability; wetting angle; Heat transfer; Heating; Rough surfaces; Silicon; Surface roughness; Surface treatment; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on
  • Conference_Location
    Cancun
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-9632-7
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2011.5734645
  • Filename
    5734645