DocumentCode
2770948
Title
Significant boiling enhancement with surfaces combining superhydrophilic and superhydrophobic patterns
Author
Betz, Amy Rachel ; Jenkins, James R. ; Kim, Chang-Jin C J ; Attinger, Daniel
Author_Institution
Columbia Univ., New York, NY, USA
fYear
2011
fDate
23-27 Jan. 2011
Firstpage
1193
Lastpage
1196
Abstract
In this work we describe the manufacturing and characterization of patterned surfaces with large spatial contrast in wettability. We find drastic enhancement of pool boiling performance in water. In comparison to a hydrophilic SiO2 surface with a wetting angle of 7°, surfaces combining superhydrophilic and superhydrophobic patterns can quadruple the heat transfer coefficient (HTC). Superhydrophilic surface with hydrophobic islands can increase the critical heat flux (CHF) by 80%. This performance enhancement is important for applications such as electronics cooling, because the increased HTC allows a greater amount of heat to be removed at a lower wall superheat.
Keywords
boiling; contact angle; heat transfer; hydrophilicity; hydrophobicity; microfabrication; micromechanical devices; nanoelectromechanical devices; nanofabrication; silicon compounds; wetting; SiO2; critical heat flux; electronics cooling; heat transfer coefficient; hydrophilic surface; hydrophobic islands; patterned surfaces; pool boiling; spatial contrast; superhydrophilic patterns; superhydrophobic patterns; water; wettability; wetting angle; Heat transfer; Heating; Rough surfaces; Silicon; Surface roughness; Surface treatment; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on
Conference_Location
Cancun
ISSN
1084-6999
Print_ISBN
978-1-4244-9632-7
Type
conf
DOI
10.1109/MEMSYS.2011.5734645
Filename
5734645
Link To Document