• DocumentCode
    2771779
  • Title

    Directed nanorobot-based handling of single nanowires

  • Author

    Bartenwerfer, Malte ; Fatikow, Sergej

  • Author_Institution
    Div. of Microrobotics & Control Eng., Univ. of Oldenburg, Oldenburg, Germany
  • fYear
    2011
  • fDate
    7-10 Aug. 2011
  • Firstpage
    183
  • Lastpage
    188
  • Abstract
    Within this paper, a new experimental implementation is presented in order to facilitate well directed handling of silicon nanowires with dimensions of about 10 μm length and less than 100 nm diameter. The experimental strategy employs adhesive bond techniques and FIB assisted milling to transfer nanowires from a production substrate to a different electrode substrate for electrical characterization. Thus, further electrical characterization measurements were achieved, which are important for future applications of nanowires. An accurate picking from high-dense nanowire forests, a transfer over several centimeters, and a well directed placement onto the target are feasible using the presented handling technique. This contribution explains advantages, prospects and limits of the proposed handling strategy with regard to an automation heading for future applications.
  • Keywords
    adhesive bonding; industrial robots; materials handling; microrobots; milling; nanowires; semiconductor industry; FIB assisted milling; adhesive bond technique; directed nanorobot-based handling; electrical characterization measurement; high-dense nanowire forests; silicon nanowire; single nanowire handling; Electrodes; End effectors; Ion beams; Nanowires; Silicon; Substrates; automation; electrical characterization; handling; robotic; silicon nanowire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronics and Automation (ICMA), 2011 International Conference on
  • Conference_Location
    Beijing
  • ISSN
    2152-7431
  • Print_ISBN
    978-1-4244-8113-2
  • Type

    conf

  • DOI
    10.1109/ICMA.2011.5985653
  • Filename
    5985653