DocumentCode
2771779
Title
Directed nanorobot-based handling of single nanowires
Author
Bartenwerfer, Malte ; Fatikow, Sergej
Author_Institution
Div. of Microrobotics & Control Eng., Univ. of Oldenburg, Oldenburg, Germany
fYear
2011
fDate
7-10 Aug. 2011
Firstpage
183
Lastpage
188
Abstract
Within this paper, a new experimental implementation is presented in order to facilitate well directed handling of silicon nanowires with dimensions of about 10 μm length and less than 100 nm diameter. The experimental strategy employs adhesive bond techniques and FIB assisted milling to transfer nanowires from a production substrate to a different electrode substrate for electrical characterization. Thus, further electrical characterization measurements were achieved, which are important for future applications of nanowires. An accurate picking from high-dense nanowire forests, a transfer over several centimeters, and a well directed placement onto the target are feasible using the presented handling technique. This contribution explains advantages, prospects and limits of the proposed handling strategy with regard to an automation heading for future applications.
Keywords
adhesive bonding; industrial robots; materials handling; microrobots; milling; nanowires; semiconductor industry; FIB assisted milling; adhesive bond technique; directed nanorobot-based handling; electrical characterization measurement; high-dense nanowire forests; silicon nanowire; single nanowire handling; Electrodes; End effectors; Ion beams; Nanowires; Silicon; Substrates; automation; electrical characterization; handling; robotic; silicon nanowire;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechatronics and Automation (ICMA), 2011 International Conference on
Conference_Location
Beijing
ISSN
2152-7431
Print_ISBN
978-1-4244-8113-2
Type
conf
DOI
10.1109/ICMA.2011.5985653
Filename
5985653
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