• DocumentCode
    2772594
  • Title

    A note on trap recombination in high voltage device structures

  • Author

    Benda, V.

  • Author_Institution
    Dept. of Electrotechnol., Czech Tech. Univ., Prague, Czech Republic
  • fYear
    2003
  • fDate
    16-18 Dec. 2003
  • Firstpage
    309
  • Lastpage
    312
  • Abstract
    The carrier lifetime is a very important parameter influencing all important characteristics of bipolar devices both discrete and integrated structures and carrier lifetime tailoring is an important part of power semiconductor device technology. In presented paper, recombination through traps (centres with a deep energy level between edge of bandgap and Fermi level) is discussed in more details. It has been shown that some traps can considerably influence recombination rate in silicon, and that at some traps a considerable temperature dependence of the centre cross-sections may be found. This is demonstrated in the case of iridium traps with a deep energy level 0.28 eV below the conduction band which capture cross-section temperature dependence has been found σp ∝ T4 and σn ∝ T4. Further, the problem on low injection carrier lifetime in low-doped layers of high voltage semiconductor devices is also discussed.
  • Keywords
    Fermi level; carrier lifetime; charge injection; conduction bands; deep levels; electron traps; electron-hole recombination; elemental semiconductors; energy gap; hole traps; semiconductor diodes; silicon; Fermi level; Ir; Si; bandgap; bipolar devices; conduction band; deep energy level; high voltage semiconductor device structures; injection carrier lifetime; integrated structures; iridium traps; power semiconductor device technology; silicon; trap recombination; Charge carrier lifetime; Energy capture; Energy states; Photonic band gap; Power semiconductor devices; Radiative recombination; Semiconductor devices; Silicon; Temperature dependence; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Solid-State Circuits, 2003 IEEE Conference on
  • Print_ISBN
    0-7803-7749-4
  • Type

    conf

  • DOI
    10.1109/EDSSC.2003.1283538
  • Filename
    1283538