DocumentCode :
2773869
Title :
Towards A QML Approach In Electronic Packaging
Author :
Dasgupta, A. ; Verma, S. ; Agarwal, R.K.
Author_Institution :
CALCE Electronic Packaging Research Center University of Maryland, College Park, MD 20742
fYear :
1992
fDate :
28-30 Sep 1992
Firstpage :
19
Lastpage :
29
Keywords :
Analytical models; Costs; Educational institutions; Electronic equipment testing; Electronics packaging; Manufacturing industries; Manufacturing processes; Product design; Pulp manufacturing; Virtual manufacturing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
Type :
conf
DOI :
10.1109/IEMT.1992.639856
Filename :
639856
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2773869
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