• DocumentCode
    2774077
  • Title

    Optimization Of Mold Process Parameters And Tooling Variables For Highest Quality Plastic Packaging

  • Author

    Wittmershaus, Janice ; Kar, Rudra ; Verwoerd, Wouter

  • Author_Institution
    INTEL Corporation
  • fYear
    1992
  • fDate
    28-30 Sep 1992
  • Firstpage
    30
  • Lastpage
    33
  • Keywords
    Delamination; Design for experiments; Design optimization; Lead; Leg; Passive optical networks; Plastic packaging; Shape control; Temperature control; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
  • Print_ISBN
    0-7803-0755-0
  • Type

    conf

  • DOI
    10.1109/IEMT.1992.639857
  • Filename
    639857
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2774077