Experimental investigation of an enhanced thermosyphon heat loop for cooling of a high performance electronics module

Author

Chu, R.C. ; Simons, R.E. ; Chrysle, G.M.

Author_Institution

Int. Bus. Machines, Poughkeepsie, NY, USA

fYear

1999

fDate

9-11 March 1999

Firstpage

1

Lastpage

9

Abstract

This paper discusses the investigation of module cooling utilizing an enhanced thermosyphon heat loop as an alternative to direct air cooling or liquid-to-air cooling with forced convection of the liquid. Using water as the working fluid in the thermosyphon, experiments were conducted to investigate the effects of fill volume, heat load, and condenser air flow rate on overall thermosyphon performance in terms of thermal resistance. Enhancement of evaporator performance using fins was also investigated and the results are reported in the paper.

Keywords

cooling; integrated circuit packaging; integrated circuit testing; multichip modules; thermal analysis; thermal management (packaging); thermal resistance; condenser air flow rate; cooling; direct air cooling; electronics module; enhanced thermosyphon heat loop; evaporator fins; evaporator performance; fill volume; forced convection; heat load; high performance electronics module; liquid-to-air cooling; module cooling; thermal resistance; thermosyphon; thermosyphon performance; water working fluid; CMOS technology; Costs; Difference equations; Electronics cooling; Integrated circuit technology; Resistance heating; Thermal conductivity; Thermal loading; Thermal resistance; Water heating;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 1999. Fifteenth Annual IEEE

Conference_Location

San Diego, CA, USA

ISSN

1065-2221

Print_ISBN

0-7803-5264-5

Type

conf

DOI

10.1109/STHERM.1999.762421

Filename

762421