• DocumentCode
    2774339
  • Title

    First principles calculations in silicon: Structural and electronic properties of point defect

  • Author

    Niu, Mang ; Li, Deyao ; Sheng, Baicheng ; Shao, Xiaohong ; Liu, Wei ; Wang, Zhiqiang

  • Author_Institution
    Coll. of Sci., Beijing Univ. of Chem. Technol., Beijing, China
  • fYear
    2011
  • fDate
    7-10 Aug. 2011
  • Firstpage
    1423
  • Lastpage
    1427
  • Abstract
    Using first-principles calculations, the structural and electronic properties of point defected silicon systems were systematically studied. Based on this, the mobility of pure and defected silicon were calculated by a combination method of first-principles and Boltzmann transport theory. The results indicate that there are some defect bands appear in the band gap of defected Si, and the defect bands increase with the number of defects, resulting in the changes of the density of states (DOS) around Fermi level. The electron mobility increases with the number of defects. However, the hole mobility decreases with the number of defects. In addition, the influence of temperature to mobility was calculated. The results show that both electron and hole mobility decreases with temperature.
  • Keywords
    Boltzmann equation; Fermi level; ab initio calculations; defect states; electron mobility; electronic density of states; elemental semiconductors; energy gap; hole mobility; point defects; silicon; Boltzmann transport theory; DOS; Fermi level; band gap; defect bands; defected silicon mobility; density of states; electron mobility; electronic property; first principles calculations; hole mobility; point defected silicon systems; pure silicon mobility; structural property; Effective mass; Electric potential; Electron mobility; Photonic band gap; Scattering; Silicon; Defect; First-principle; Mobility; Radiation; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronics and Automation (ICMA), 2011 International Conference on
  • Conference_Location
    Beijing
  • ISSN
    2152-7431
  • Print_ISBN
    978-1-4244-8113-2
  • Type

    conf

  • DOI
    10.1109/ICMA.2011.5985785
  • Filename
    5985785