Title :
Return via connections for extending signal link path bandwidth of via transitions
Author :
Chang, Xin ; Archambeault, Bruce ; Cocchini, Matteo ; De Paulis, Francesco ; Sivarajan, Vysakh ; Zhang, Yaojiang ; Fan, Jun ; Connor, Samuel ; Orlandi, Antonio ; Drewniak, Jim
Author_Institution :
Missouri Univ. of Sci. & Technol., Rolla, MO
Abstract :
This paper discusses a fast and accurate way to assess the impact of signal vias where the return current must change reference planes, including the effect of a return current via placed various distances from the signal via. The equivalent circuit includes capacitance of the via anti-pad as well as cavity effects.
Keywords :
electromagnetic compatibility; integrated circuit interconnections; EMI; cavity resonance; equivalent circuit; return current; return via connections; signal link path bandwidth; via transitions; Analytical models; Bandwidth; Capacitors; Circuit simulation; Dielectric losses; Electromagnetic interference; Equivalent circuits; Impedance; Resonance; Signal analysis; EMI; Signal integrity; cavity resonance; via;
Conference_Titel :
Electromagnetic Compatibility - EMC Europe, 2008 International Symposium on
Conference_Location :
Hamburg
Print_ISBN :
978-1-4244-2737-6
Electronic_ISBN :
978-1-4244-2737-6
DOI :
10.1109/EMCEUROPE.2008.4786874
