Semiconductor devices and circuits: smaller, faster, denser and what it all means

Author

Blackburn, D.L.

Author_Institution

Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA

fYear

1999

fDate

9-11 March 1999

Firstpage

73

Abstract

Summary form only given. The Semiconductor Industry Association has developed a roadmap of technology needs, the National Technology Roadmap for Semiconductors (NTRS), through the year 2012. In this presentation, these ´needs´ are put into the perspective of actual device and circuit fabrication and operation to see how and why the needs arise. Links are also drawn between the device and circuit needs and requirements and the subsequent packaging needs and requirements that they help to drive. The objective of the tutorial is to provide a background perspective of semiconductor circuit fabrication and operation for the thermal and packaging engineer.

Keywords

integrated circuit manufacture; integrated circuit packaging; technological forecasting; thermal management (packaging); National Technology Roadmap for Semiconductors; Semiconductor Industry Association roadmap; circuit fabrication; circuit operation; device fabrication; device operation; packaging; semiconductor circuit fabrication; semiconductor circuit operation; semiconductor circuits; semiconductor devices; thermal aspects; Circuits; Electronics industry; Fabrication; NIST; Semiconductor device packaging; Semiconductor devices; Thermal engineering;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 1999. Fifteenth Annual IEEE

Conference_Location

San Diego, CA, USA

ISSN

1065-2221

Print_ISBN

0-7803-5264-5

Type

conf

DOI

10.1109/STHERM.1999.762431

Filename

762431