• DocumentCode
    2774479
  • Title

    Thermal conductivity homogeneity and topography characterization

  • Author

    Mathis, Nancy ; DeSorgo, Miksa

  • Author_Institution
    Mathis Instrum. Ltd., Fredericton, NB, Canada
  • fYear
    1999
  • fDate
    9-11 March 1999
  • Firstpage
    113
  • Lastpage
    118
  • Abstract
    Thermal conductivity is a key parameter for evaluating materials involved in thermal management. Thermal conductivity is a consideration at all levels when thermal engineers design for optimum heat dissipation, bonding and homogeneity. Materials have emerged that are filled with high thermal conductivity materials such as boron nitride and graphite. The homogeneity of such materials has been measured through nondestructive localized thermal conductivity testing. The method involves an interfacial transient technique used to evaluate a material in a grid-wise fashion. The minimum sample area of each test location was 5 mm/spl times/50 mm, and the total time that was required for each test was under three minutes. A homogeneity factor (HF) is introduced to relate material results. One of the two formulations tested was determined to be slightly heterogeneous within statistical limits of the test procedure.
  • Keywords
    cooling; filled polymers; nondestructive testing; thermal conductivity measurement; thermal management (packaging); transient analysis; 5 mm; 50 mm; BN; C; boron nitride filler; graphite filler; grid-wise material evaluation; high thermal conductivity filler materials; homogeneity factor; interfacial transient technique; minimum sample area; nondestructive localized thermal conductivity testing; optimum bonding; optimum heat dissipation; optimum materials homogeneity; test location; test time; thermal conductivity; thermal conductivity homogeneity; thermal conductivity topography; thermal design; thermal management materials; Bonding; Boron; Conducting materials; Design engineering; Heat engines; Surfaces; Testing; Thermal conductivity; Thermal engineering; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 1999. Fifteenth Annual IEEE
  • Conference_Location
    San Diego, CA, USA
  • ISSN
    1065-2221
  • Print_ISBN
    0-7803-5264-5
  • Type

    conf

  • DOI
    10.1109/STHERM.1999.762436
  • Filename
    762436