DocumentCode
2774493
Title
Lead On Chip TSOP Assembly Process For Fast Sram With Peripherally Located Bond Pads
Author
Hagen, Debbie ; McDermott, Joan ; Bigler, Jerry ; Cavasin, Daniel ; Primeaux, Francis ; Tran, Ziep ; Afshar, David
Author_Institution
Motorola
fYear
1992
fDate
28-30 Sep 1992
Firstpage
39
Lastpage
47
Keywords
Assembly; Atherosclerosis; Bonding; Integrated circuit packaging; Lab-on-a-chip; Microassembly; Plastic packaging; Random access memory; Semiconductor device packaging; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN
0-7803-0755-0
Type
conf
DOI
10.1109/IEMT.1992.639859
Filename
639859
Link To Document