Modeling the skin effect in the time domain for the simulation of circuit interconnects

Author

Magdowski, Mathias ; Kochetov, Sergey ; Leone, Marco

Author_Institution

Inst. for Fundamental Electr. Eng. & Electromagn. Compatibility, Otto-von-Guericke Univ. Magdeburg, Magdeburg

fYear

2008

fDate

8-12 Sept. 2008

Firstpage

1

Lastpage

6

Abstract

The skin effect is characterized by a reduction of a conductor´s effective cross-sectional area and is of great importance for the losses in electrical interconnection systems. Many well-known solutions exist for its modeling in the frequency domain. Based on the method of full spectrum convolution macromodeling a new skin-effect model is developed for an efficient numerical time-domain analysis. The integration of this model into the transmission line model and into the PEEC model is studied in two examples. Thereby the influence of skin effect on the simulation of interconnection systems with transient current and voltage responses is investigated.

Keywords

integrated circuit interconnections; integrated circuit modelling; numerical analysis; skin effect; time-domain analysis; PEEC model; circuit interconnects; electrical interconnection systems; full spectrum convolution macromodeling; numerical time-domain analysis; skin effect; time domain; Circuit simulation; Conductors; Convolution; Frequency; Impedance; Inductance; Integrated circuit interconnections; Power transmission lines; Skin effect; Wire; skin effect modeling time domain full spectrum convolution macromodeling PEEC;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility - EMC Europe, 2008 International Symposium on

Conference_Location

Hamburg

Print_ISBN

978-1-4244-2737-6

Electronic_ISBN

978-1-4244-2737-6

Type

conf

DOI

10.1109/EMCEUROPE.2008.4786892

Filename

4786892