DocumentCode
2774695
Title
bibliography of liquid cooled heat sinks for thermal enhancement of electronic packages
Author
Shaukatullah, H.
Author_Institution
Div. of Storage Syst., IBM Corp., Tucson, AZ, USA
fYear
1999
fDate
9-11 March 1999
Firstpage
231
Lastpage
245
Abstract
A bibliography of 225 publications dealing with liquid cooled heat sinks for thermal enhancement of electronic packages is presented. The bibliography also includes papers dealing with design and performance analysis of heat sinks and extended surfaces cooled with liquids. The papers are arranged in several categories.
Keywords
bibliographies; cooling; design engineering; heat sinks; thermal management (packaging); bibliography; electronic package thermal enhancement; electronic packages; heat sink design; heat sink performance analysis; liquid cooled extended surfaces; liquid cooled heat sinks; Bibliographies; Books; Circuits; Cold plates; Electronic components; Electronic packaging thermal management; Electronics cooling; Heat sinks; Thermal management; Thermal management of electronics;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 1999. Fifteenth Annual IEEE
Conference_Location
San Diego, CA, USA
ISSN
1065-2221
Print_ISBN
0-7803-5264-5
Type
conf
DOI
10.1109/STHERM.1999.762454
Filename
762454
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