DocumentCode :
2774768
Title :
SPICE-compatible thermal simulation with lumped circuit modeling for thermal reliability analysis based on modeling order reduction
Author :
Wang, Ting-Yuan ; Chen, Charlie Chung-Ping
Author_Institution :
Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
fYear :
2004
fDate :
2004
Firstpage :
357
Lastpage :
362
Abstract :
With the growing power dissipation in modem high performance VLSI designs, nonuniform temperature distribution and limited heat-conduction capability have caused thermal induced performance and reliability degradation. However the problem modeled by finite difference method for interconnect reliability analysis has huge size if we require the resolution with wire width. In addition, the generated lumped circuit has significant number of input sources, and the bottleneck of traditional model reduction methods is the big number of input ports. In this paper we propose a method of SPICE-compatible thermal simulation for interconnect reliability analysis. The lumped thermal circuit modeling with adaptive approach is used to reduce the problem size. The improved extended Krylov subspace (IEKS) method, independent of the number of input ports, is used for thermal simulation. The experimental results show that our method provides highly accurate results with performance improvement 15 x over T-Spice for the problem with node number 72428.
Keywords :
SPICE; VLSI; circuit CAD; circuit simulation; heat sinks; integrated circuit design; integrated circuit modelling; integrated circuit reliability; reduced order systems; temperature distribution; thermal management (packaging); SPICE-compatible thermal simulation; equivalent thermal resistors; heat sinks; high performance VLSI design; improved extended Krylov subspace; interconnect reliability; limited heat-conduction capability; lumped circuit modeling; modeling order reduction; nonuniform temperature distribution; packaging; power dissipation; thermal reliability analysis; Analytical models; Circuit simulation; Finite difference methods; Integrated circuit interconnections; Modems; Power dissipation; Temperature distribution; Thermal degradation; Very large scale integration; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality Electronic Design, 2004. Proceedings. 5th International Symposium on
Print_ISBN :
0-7695-2093-6
Type :
conf
DOI :
10.1109/ISQED.2004.1283700
Filename :
1283700
Link To Document :
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