Title :
Encapsulation Of Flip Chip Structures
Author :
Machuga, Steven C. ; Lindsey, Scott E. ; Moore, Kevin D. ; Skipor, Andrew F.
Author_Institution :
Motorola Inc.
Keywords :
Assembly; Encapsulation; Fatigue; Flip chip; Integrated circuit interconnections; Packaging; Silicon devices; Substrates; Thermal expansion; Wire;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
DOI :
10.1109/IEMT.1992.639861
