A superficial formulation for the broadband analysis of planar interconnects

Author

Assante, Dario ; Chiariello, Andrea Gaetano ; Zamboni, Walter

Author_Institution

Univ. of Naples Federico II, Naples

fYear

2008

fDate

8-12 Sept. 2008

Firstpage

1

Lastpage

6

Abstract

The paper presents a full-wave integral formulation of Maxwell´s equations for the analysis of planar interconnects typically used in PCBs. The presence of the dielectric is taken into account by means of the method of the Green´s function, whose components are efficiently computed using a polynomial fitting based on the Total Least Square method. This implementation has been included in the surface integral formulation and its numerical implementation SURFCODE, enabling the analysis of single-layered planar interconnects.

Keywords

Green´s function methods; Maxwell equations; integrated circuit interconnections; Green function; Maxwell equations; broadband analysis; full-wave integral formulation; planar interconnects; superficial formulation; total least square method; Conductors; Dielectrics; Frequency; Green´s function methods; Integral equations; Kernel; Least squares approximation; Maxwell equations; Nonhomogeneous media; Performance analysis; Green´s function; Planar interconnects; Sommerfeld Integrals; superficial integral formulation;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility - EMC Europe, 2008 International Symposium on

Conference_Location

Hamburg

Print_ISBN

978-1-4244-2737-6

Electronic_ISBN

978-1-4244-2737-6

Type

conf

DOI

10.1109/EMCEUROPE.2008.4786924

Filename

4786924