• DocumentCode
    2775515
  • Title

    High frequency and transient coupling to pasive conductors near grounding systems in layered soil

  • Author

    Arnautovski-Toseva, Vesna ; Grcev, Leonid ; Petkoski, Spase ; El Khamlichi Drissi, Khalil

  • Author_Institution
    Fac. of Electr. Eng. & Inf. Technol., Ss Cyril & Methodius Univ., Skopje
  • fYear
    2008
  • fDate
    8-12 Sept. 2008
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    This paper presents the ongoing research results of the high frequency and transient grounding system analysis in two-layer soil structure. On the basis of rigorous electromagnetic field theory, which involves Sommerfeld´s integrals, the mathematical model is formulated by the mixed potential integral equation (MPIE). Detailed analysis of a high frequency performance of a typical horizontal grounding conductor placed in the upper or in the bottom layer is given. It is shown that because of the presence of two distinct layers the current distribution and the impedance to ground are highly affected by the parameters of both soil layers. Also, the current distribution in near-by passive horizontal conductor is analyzed. At the end of the paper some observations about the effects of two-layer soil structure at high frequencies are given.
  • Keywords
    conductors (electric); current distribution; earthing; electromagnetic coupling; electromagnetic field theory; integral equations; soil; transient analysis; Sommerfeld integrals; current distribution; mathematical model; mixed potential integral equation; near-by passive horizontal conductor; passive conductors; rigorous electromagnetic field theory; transient grounding system analysis; two-layer soil structure; typical horizontal grounding conductor; Conductors; Current distribution; Electromagnetic field theory; Electromagnetic transients; Frequency; Grounding; Integral equations; Mathematical model; Soil; Transient analysis; electromagnetic model; grounding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility - EMC Europe, 2008 International Symposium on
  • Conference_Location
    Hamburg
  • Print_ISBN
    978-1-4244-2737-6
  • Electronic_ISBN
    978-1-4244-2737-6
  • Type

    conf

  • DOI
    10.1109/EMCEUROPE.2008.4786932
  • Filename
    4786932