DocumentCode

2775716

Title

Conductive Filament Formation In Printed Wiring Boards

Author

Wul, Bi-Chu ; Pecht, Michael ; Jennings, David

Author_Institution

University of Maryland, College Park, Maryland 20742 2Collins Divisions, Rockwell International

fYear

1992

fDate

28-30 Sep 1992

Firstpage

74

Lastpage

79

Keywords

Coatings; Conducting materials; Copper; Electrodes; Electronic equipment testing; Glass; Materials testing; Resins; Samarium; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International

Print_ISBN

0-7803-0755-0

Type

conf

DOI

10.1109/IEMT.1992.639865

Filename

639865