• DocumentCode
    2775881
  • Title

    Numerical analysis of H-plane waveguide junctions by using densely arrayed electric line currents

  • Author

    Yamamoto, Tetsuya

  • Author_Institution
    Electromagn. Waves Div., Nat. Metrol. Inst. of Japan, Tsukuba
  • fYear
    2008
  • fDate
    5-11 July 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents the scattering property in tapered right-angle corner bend and waveguide T-junction with wedge realized by electric line currents inside the rectangular cavity. The power transmission and reflection coefficients are calculated and presented. These results are compared with the literature and excellent agreements are confirmed. First, the transmission property in right-angle corner bend as a function of normalized frequency is considered. Two analysis models without and with 45deg taper at the corner bend are examined. Secondly, the scattering characteristics in the waveguide T-junctions are calculated. Finally, the transmission and reflection property of the T-junction with wedge realized by using uniform electric line currents is calculated. The validity of this analysis technique using uniform electric current approximation expressed by delta function can be certified. Application of this calculation technique to the other analysis models are a subject for future studies.
  • Keywords
    antenna accessories; numerical analysis; rectangular waveguides; waveguide junctions; H-Plane waveguide junctions; delta function; dense arrayed electric line currents; numerical analysis; power transmission; rectangular cavity; reflection coefficients; right-angle corner bend; slotted waveguide arrays; Current; Electromagnetic scattering; Electromagnetic waveguides; Moment methods; Numerical analysis; Rectangular waveguides; Reflection; Surface waves; Waveguide junctions; Waveguide theory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 2008. AP-S 2008. IEEE
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    978-1-4244-2041-4
  • Electronic_ISBN
    978-1-4244-2042-1
  • Type

    conf

  • DOI
    10.1109/APS.2008.4619802
  • Filename
    4619802