• DocumentCode
    277601
  • Title

    Product introduction in PCB design and assembly

  • Author

    White, A.J. ; Lo, E.K.

  • Author_Institution
    Salford Univ., UK
  • fYear
    1992
  • fDate
    27-29 Jul 1992
  • Firstpage
    145
  • Lastpage
    150
  • Abstract
    The design and manufacture of PCBs is carried out in a variety of ways and may vary substantially from one company and application to another. Time-to-market is critical in all industries where changes in technology and customer requirements occur rapidly. There is a wide range of complex issues associated with reducing time-to-market and it is only by addressing these in a coordinated manner that existing electronics manufacturers will continue to compete successfully in international markets. The authors conclude that reductions in time-to-market will depend on better management of product introduction (PI) into manufacture. A formal approach to the management of PI and the careful application of emerging computer technologies will complement the team work of those involved in PI by providing a focal point for all relevant PI information within a structured but flexible framework. The PI performance of any companies operating in fast-moving industries will be increasingly important to continuing commercial success as customers come to expect more of the latest technologies in the products they buy, having little regard for the complexity of the tasks involved in getting those products to the marketplace
  • Keywords
    CAD/CAM; DP management; circuit CAD; printed circuit design; printed circuit manufacture; PCB design; PI performance; commercial success; customer requirements; electronics manufacturers; emerging computer technologies; flexible framework; formal approach; international markets; marketplace; product introduction; team work; time-to-market;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Factory 2000, 1992. 'Competitive Performance Through Advanced Technology'., Third International Conference on (Conf. Publ. No. 359)
  • Conference_Location
    York
  • Print_ISBN
    0-85296-548-6
  • Type

    conf

  • Filename
    171869