Nanocomposite for Advanced Packaging of Microelectronics

The advances of semiconductor technology are mainly due to the advances of polymeric materials. These include the use of polymers as adhesives(both conductive and non- conductive), interlayer dielectrics (low-k, low loss dielectrics), encapsulants (discrete and wafer level packaging), embedded passives (high-k and high-Q materials), superhydrophobic self-cleaning lotus effect surfaces, and etc. In this presentation, we will review some of the recent advances of polymeric materials and polymer nanocomposites currently being investigated for these types of applications, such as lead-free electrically conductive adhesives (ECAs) for fine pitch and high current density interconnects, flip chip and wafer level underfills, superhydrophobic self-cleaning lotus effect surfaces, as well as high-k and high-Q nanocomposites for embedded capacitors and inductors.